.

The spinner system is used for spin-coating a homogeneous layer of photoresist (or other material) on the surface of the samples. In such procedures, a solution of the desired material (with a volatile liquid solvent) is spun on the surface. The thickness of the layer is determined by the speed, acceleration and duration of the spin, as well as the surface adhesion between the solution and the sample surface.  

Spin Coater consisting of:

- - Capable of processing wafers up to 8"/200mm diameter or 6" square

- Automatic Photoresist Dispense

- Cover Maintains Solvent Saturated Atmosphere

- Allows for lower spin speeds and evaporations reducing stress on substrate

- Maximum Spin Speed 5,000 RPM

- Reduces usual defects such as rebounding, splashback, comet, ad striation for improved uniformity throughout wafer or substrate.
 

Home    Introduction    professors   Publications    Members    Projects    Outreach    Laboratories    Sitemap    Gallery   Links    Sponsors    Contact Us