.

Sputtering system is exploited for deposition of thin films in RF-plasma medium. High energy activated ions and radicals attack the target and free particles from the surface which are then orientated by the unidirectional plasma and deposited on the samples. Sputtering offers a more homogeneous surface of the deposited layer in comparison with e-beam. The main industrial application of sputtering is deposition of metals. In general, a limited range of materials may be feasibly deposited by means of this technique.  

RF/DC Sputtering System consisting of:

Completely Microprocessor Controlled

Designed to operate bi-directionally, left or right, and is also capable of multipass deposition.
1.5 kW RF Generator, operating on 13.56 Mhz
DC Bias Capability
materials: Si,Cr,Si3N4,SiO2,Ti,Mo,W,Cu,Ni,ITO,..
 

Home    Introduction    professors   Publications    Members    Projects    Outreach    Laboratories    Sitemap    Gallery   Links    Sponsors    Contact Us