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Electron-Beam (E-Beam) system is employed for vacuum deposition by means of electron-beam assisted or thermal evaporation. Deposition rate and the thickness of the deposited layer are controlled by a Quartz Crystal Microbalance (QCM). Almost all kind of materials may be deposited by this system but the quality of the deposited layer is not essentially reasonable in terms of the residual stresses and step coverage. Today, the industrial application of the e-beam and thermal evaporation systems is limited to metallization; however, still various lab applications are provided by such systems.
Full Opening, Water Cooled Chamber materials: Si,Cr,SiO2,Ti,Mo,Cu,Ni,..
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